OSRAM Multi Chip LED, LRTBR98G

OSRAM Multi Chip LED, LRTBR98G
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Description

Miniature package design for highest pixel density, perfect for applications with short viewing distances, e. g. VIP areas. Premium contrast thanks to black package design.
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Details

Parameters

Color of emission
Red (612-630 nm)
True Green (513-545 nm)
Blue (450-480 nm)
Electrical power
0.041 W
0.064 W
0.064 W
Low
Low
Low
Brightness
Ī¦V
0.201 lm
IV
0.0775 cd
Ī¦E
2.69 mW
IE
1.04 mW/sr
Beam angle
āˆ¢
100 Ā°
Operating temperature
Top min.
-30 Ā°C
Top max.
85 Ā°C
Dimension
l
1.6 mm
w
1.6 mm
h
0.9 mm

Application fields

Lighting Entertainment

Ordering codes

Product Type Description Order No. Availability
LRTBR98G-R5T-1+S7T7-35+PQ-25 ā— Iv = 125 ... 450 mcd (IFā–”=ā–”20ā–”mA)
ā— Iv = 224 ... 560 mcd (IFā–”=ā–”20ā–”mA)
ā— Iv = 43 ... 112 mcd (IFā–”=ā–”20ā–”mA) 		Q65111A3103
Status information
Full production
Pre-production
Not planned for new design
Ordering and shipping are still possible
Discontinued
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Distribution partners:
Farnell
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Mouser
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Downloads

Application note

Light guides

Product related
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Advanced LED rework procedure for video wall and signage application

Product related
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Customer complaint management ā€” Details on return shipments for failure analysis request (FAR)

General information
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JP

Details on photobiological safety of LED light sources

General information
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Reliability and lifetime of LEDs

General information
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Importing rayfiles and ray-measurement files of LEDs

General information
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JP

Chemical compatibility of LEDs

General information
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JP

Measurement, calibration and measurement uncertainty of LEDs

General information
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ESD protection while handling LEDs

Handling recommendations
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Dry pack information

Handling recommendations
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JP

Fundamentals of LED handling

Handling recommendations
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CN
JP

Measuring of the temperature profile during the reflow solder process

Soldering and processing
EN
DE
CN
JP

Processing of SMD LEDs

Soldering and processing
EN
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CN
JP

Recommended pick-and-place tools of LEDs

Soldering and processing
EN
DE
CN
JP

Further details on lead free reflow soldering of LEDs

Soldering and processing
EN
DE
CN
JP

PCB technologies for LED applications

Thermal management
EN
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CN
JP

Package related thermal resistance of LEDs

Thermal management
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JP

Temperature measurement with thermocouples

Thermal management
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CN
JP

Thermal management of LED light sources

Thermal management
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CN
JP

Determination of resistances for brightness compensation

Electrical design
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CN
JP

Comparison of simple LED circuits for low power LEDs

Electrical design
EN
DE
CN
JP

Dimming LEDs with respect to grouping current

Electrical design
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CN
JP

The basic principles of Electrical Overstress (EOS)

Electrical design
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JP

Resources

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