Standard Low-Beam / High Beam

With »heatsinkless LEDs« OSRAM Opto Semiconductors is revolutionizing classic headlights for high beam/low beam and is aiming to replace halogen lights in the long run.

Existing headlights in the market rely on heat sinks for thermal management. In contrast, the basic idea for cooling the LEDs within the system is to rely on free convection starting from metal core PCBs instead of using dedicated heat sinks. Due to a high electrical efficiency of the light sources, low thermal management efforts and the possibility to use low cost PCBs, a cost optimized system can be designed. The enhanced space also allows for more design freedom while still keeping the required brightness.

Additional high beam spot lamps for extra long range can be realized by high luminance LEDs. Also see laser light for long range illumination.

#DestinationTomorrow

OSLON® Black Flat

  • Good contrast
  • Good Rth performance

OSLON® Black Flat S

  • Best in class luminance
  • Highest flux performance
  • Good contrast for reflector design (Integrated shutter)
  • High 2nd level reliability
  • Improved solder pad geometry by matches CTEs
  • Optimized Rth
  • Chip position marking

OSLON® Black Flat X

  • Highest performance (460lm/chip @1A) can reduce heatsink size or remove it from the headlamp design
  • Compatible with Al-metal core boards
  • High contrast of 1:200 due to black package material and TiO2 casting
  • Uniform light pattern
  • Extreme low thermal resistance
  • High robustness against harsh ambient conditions
  • 2-5 chips are individually addressable
  • Highly homogenic color over angle radiation due to dielectric coatin
  • Less power consumption (CO2)

OSLON® Compact PL

  • Best in class luminance
  • Highest flux performance
  • Notchless chip technology for easier optical design
  • Electrically isolated thermal pad for improved thermal performance
  • Compact package

OSLON® Compact CL

  • Solderable on aluminium PCBs

OSLON® Black Flat

  • 1mm² notch chip
  • Lead frame package
  • Good contrast & optimized Rth

OSLON® Black Flat S

  • 1mm² notchless chip
  • Lead frame package
  • Good contrast & optimized Rth
  • Single addressable chips

OSLON® Black Flat X

  • Highest efficiency typ. 460lm @1000mA per chip − ideal for FWL applications where system cost is important
  • Whole family can be used with Al-metal core PCBs
  • Extremely low thermal resistance
  • High contrast due to black package and TiO2 casting
  • Get color and multi-chip devices with one design
  • Introduction of new color binning for better homogeneity
  • Color-over-angle improvement
  • Optimized leadframe design for better thermal management (only KW2 HML631.TK)

OSLON® Compact PL

  • 1mm² notchless chip
  • Ceramic package
  • 3 pad design with isolated thermal pad
  • Small z-tolerance
  • 1 to 4 chip with new technology
  • Brightness improvement
  • Increased luminance
  • Improved „color over angle“

OSLON® Compact CL

  • 1mm² notch chip
  • Ceramic package
  • 2 pad design

OSLON® Black Flat

  • Used in standardized platform modules at our key customers

OSLON® Black Flat S

  • Highest efficiency compared with highest luminance
  • Further improved efficiency enables halogen replacement (in future no more heatsink needed)
  • Reflector design

OSLON® Black Flat X

  • Automotive headlamp
  • Low beam, high beam
  • Halogen replacement

OSLON® Compact PL

  • Highest efficiency compared with highest luminance
  • Using FR4 PCB: Thermal management with isolated pad
  • Limited space: narrow positioning

OSLON® Compact CL

  • Used in standardized platform modules at our key customers